X11SPi-TF 1S-P,1/2PCI-E16,2/3-E8,4-E8g3,E4v-E8, 2×10GbE-T, 10sATA3,M.2, 8DDR4-2933,IPMI, bulk

Singl  Socket P pro Intel® Xeon® Scalable řadu, max.205W
Intel® C622 Chipset
8 DIMM, max.1TB DDR4 2933MHz ECC RDIMMs
1× PCI-Express ×16
1× PCI-Express ×16/×8
1× PCI-Express ×0/×8
1× PCI-Express ×8 g3
1× PCI-Express ×4 g3 v PCI-Express ×8
1× M.2 (2280/22110, M-key) s PCI-E 3.0 (×4) a sATA
Intel®  Dual port 10GbE-T LAN (X722 + X557-AT2 PHY)
10× SATA3
2× SuperDOM sATA3
5× USB 3.0 port (2× zadní, 2× header, 1× type "A")
6× USB 2.0 port (2× zadní, 4× header)
2× COM (1× zadní, 1×header)
VGA on board AST2500
IPMI 2.0 s KVM a vlastní LAN
Mechanické provedení: ATX 12"× 9,6"

Optimalizovaná chassi 1U:
SC512F-350B
SC813MFTQC-350CB2
SC813MFTQC-R407CB
SC113MFAC2-341CB
SC113MFAC2-R606CB
1U Heatsink:SNK-P0067PS

Optimalizovaná chassi 2U:
SC823TQ-653LPB
SC825TQC-R740LPB
SC213LT-600LPB
2U Heatsink:SNK-P0068APS4

Optimalizovaná chassi 3U:
SC833T-653B
2U Heatsink:SNK-P0068APS4